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Date: | Tue, 13 Oct 2015 19:18:11 -0400 |
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Bob, it is designed in. maximum allowable repair (2 SMT plus reflow
plus 1 repair plus 1 encapsulation as total thermal history allowable
for example) defined based on reliability test data (use simulated
repair - extra reflow for example). It depend upon where you capture
the repair, (this is not including field repair). prior to
encapsulation for example or conformal coat.... design doc should
have the details as part of tech transfer (at least in the old days).
my 2 cents.... field repair is different animal all together...(if it
is MIL, usually, no field repair due to the redundancy, spare plug
and play usually is the case).
jk
On Oct 13, 2015, at 6:57 PM, Bob Wettermann wrote:
> Technetters:
>
> I was visiting with a class III assembler today (MIL/Aero) who was
> asking
> me about other MIL/AERO customers who allow or do not allow for
> boards to
> be repaired (IPC 7721 procedures to affect repairs).
>
> As an informal "census" do you Class III assemblers and OEMs ...
>
> A. Allow repairs as a matter of course (or is it a "depends" answer)
>
> B. Allow for pad repairs (If YES under which boundary conditions?)
>
> C. Allow for corner or other laminate repairs (If YES under which
> boundary
> conditions?)
>
> D. Allow for mask repairs (If YES under which boundary conditions?)
>
> Thanks for comments in advance!
>
> Bob/BEST
> --
> Bob Wettermann
> BEST Inc
> [log in to unmask]
> Cell: 847-767-5745
>
>
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