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October 2001

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Subject:
From:
Larry Tawyea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 20 Jul 2001 14:52:44 EDT
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In a message dated 6/28/01 6:39:56 AM Central Daylight Time,
[log in to unmask] writes:

I not sure about the cooling rate for Silicon but I will bet you that if you
have any plastic IC's on the PCB they are sure to not like that profile.

Larry Tawyea

> Hello Guys,
>
> What is the best cooling down rate in a reflow oven?
> Does anybody have experience on what maximum cooling down rate
> that will not result in Silicon cracking?
> We have some silicon cracking (Chips) and we are still evaluating
> if fast cool down can cause this problem.
> My Profile is:
> Pre-heat: 150 C
> Soak: 250 C
> Reflow 1: 290 C
> Reflow 2: 290 C
> Time of Reflow: 180 secs
>
> Thank you very much in advance for your ideas tomorrow
>




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