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August 2002

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 29 Aug 2002 09:58:28 -0400
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I'm with you Blair, one look at those pictures and you gotta wonder what
is going on at On.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Hogg, Blair K.
> Sent: Thursday, August 29, 2002 9:12 AM
> To: [log in to unmask]
> Subject: Re: [TN] MUX Failures...an update to the last update
>
>
> That's it - blame the test operation. It's not like we should
> build quality into the parts, we test it in!
>
> Sorry for the rant, just have heard that too many times
> before and the hair on my neck stood up when I read it.
>
> Blair Hogg
> QA Manager
> GAI-Tronics Corp
>
> -----Original Message-----
> From: Creswick, Steven [mailto:[log in to unmask]]
> Sent: Thursday, August 29, 2002 6:17 AM
> To: [log in to unmask]
> Subject: Re: [TN] MUX Failures...an update to the last update
>
>
> All,
>
> I am sorry, but if these X-rays were taken BEFORE
> encapsulation removal, I do not see how the manufacturer has
> ANY leg on which to stand!  This does NOT have the appearance
> of ESD, or EOS damage - it is just flat out poor
> manufacturing control at the die and wire bonding operation
> ... period!  Or, more accurately...poor control at the final
> test station!
>
> You could always ship the remaining un-mounted parts to an
> x-ray house for inspection before mounting.  At least you
> would not have as much re-work hassle.  Looks like they will
> be easy enough for a person with only a high school education
> to pick out.
>
> They screwed up!!!   Period!
>
> Steve Creswick - Gentex Corporation
>
>
>
>
>
>
>  -----Original Message-----
> From: Steve Gregory [mailto:[log in to unmask]]
> Sent: Wednesday, August 28, 2002 11:20 PM
> To: [log in to unmask]
> Subject: Re: [TN] MUX Failures...an update to the last update
>
>
>
> So Earl,
>
> We all see that, how do you address this problem with the
> OEM? I ask that question subjectively...
>
> You have to know that we've already done that, and we're
> being blamed for handling....hehehe.
>
> This is the "Kobiashu Maru" scenario that I spoke of earlier.
> This is a no-win scenario. On Semiconductor will have all
> their legal staff (which is more substantial than most of us
> ever have) to support their position that their parts are
> okay...so we have to deal with it. We'll eat all the costs
> that we will incur from their sub-standard processes and
> won't be able to do anything about it...
>
> As a note, comparible Fairchild MUX's work GREAT!!!
>
> (that's been backed-up by test data...)
>
> -Steve Gregory-
>
> In a message dated 8/28/2002 7:56:33 PM Central Daylight
> Time, [log in to unmask] writes:
>
>
>
>
> again, possible wire bond crash and burn. something's amiss
> in the process.
>
> MoonMan
>
>
>
>
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