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March 2002

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Subject:
Bottom Side Reflow!!
From:
ART HAMPTON <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 6 Mar 2002 16:00:43 -0500
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        Hello Out There,



 Recently I was assigned the task of creating profiles that would fall
within the ( PWI ) for solder paste Kester ( 562 ) for processing pcbs with
several (bga) components on the top side, however the bottom side of the pcb
also has 1,200 placements of cap, and res. reflowed not epoxyed, do I need
to be worried about losing my bottom side components? 



Art

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