TECHNET Archives

February 2000

TechNet@IPC.ORG
Options: Use Monospaced Font
Show HTML Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Strength of Solder Joints
From:
Clayton Gardner <[log in to unmask]>
Reply To:
Clayton Gardner <[log in to unmask]>
Date:
Wed, 2 Feb 2000 10:24:40 +1100
Content-Type:
multipart/alternative
Parts/Attachments:
text/plain (723 bytes) , text/html (1808 bytes) 
Technet,

I have recently read in an article that the most favourable type of solder joint is formed from rapid cooling of the solder.

I am a bit confused with this as I have always been under the impression that rapid cooling of metals results in tight compact grain structures (very hard, but brittle). This is in contrast to slow cooling that forms long grain structures resulting in a stronger and tougher material (which I would have thought is what would be ideal for a solder joint - good shock resistance).

Regards....


Clayton Gardner
Engineering Manager

A.E.M.S
11-13 Fiveways Boulevard
Keysborough VIC 3173
AUSTRALIA
Ph. 61 +3 9701 5499
Fx. 61 +3 9701 5422
Mb. 0416044552
Email:  [log in to unmask]
WEB:  www.aemspl.com.au

ATOM RSS1 RSS2