Well, I should have checked for typos. 
As far as the test is concerned then it's TM-650, Method 2.6.8E.

I hope it will not contract  your constructiveness. :-)
Regards,

Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (647) 495-8727
Cell: (416) 899-1882
www.sentec.ca

-----Original Message-----
From: Inge Hernefjord <[log in to unmask]>
Date: Thu, 14 Mar 2013 17:01:26 
To: TechNet E-Mail Forum<[log in to unmask]>; Vladimir Igoshev. PhD<[log in to unmask]>
Subject: Re: [TN] IPC-6012

I'm not sure what 'contractive' means as I only have British English
between my eyes, a weakness I have to live with. Mike may come to swing his
formidable tongue, or Brian Ellis. However,  partially 'flitted' pads
sounds to me equal to future catastrophic failures. That you did not find
flitting in IPC-6012 does not mean that the failure category doesn't exist.
What is of most importance is what is required according to YOUR process
documents!  That is something that is hammered into my Cortex Electronica
 during  many years at Ericsson.

You mention nothing about your thermal stress conditions, so the gurus may
have some difficulty with doing a correct judgement.

Inge

On 13 March 2013 22:18, Vladimir Igoshev. PhD <[log in to unmask]>wrote:

> I have a question for boards gurus,
>
> We run a set of tests to assess the workmanship of a PWB. The board
> had vias-in-pad (in essence PTHs overplated with Cu pads) under a BGA.
>
> After a thermal stress the pads were partially flitted due to cracked
> laminated underneath them. To me it's a recipe for disaster  (like pad
> cratering after assembly).     However, I saw nothing about it in
> IPC-6012. Did I just miss it?
>
> I'd really appreciate any contractive comments.
>
> --
> Best regards,
>
> Vladimir Igoshev. PhD                          mailto:
> [log in to unmask]
>
> SENTEC Testing Laboratory Inc.
> 11 Canadian Road, Unit 7.
> Scarborough, ON M1R 5G1
> Tel: (416) 899-1882
> Fax: (905) 882-8812
> www.sentec.ca
>
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