Well, I should have checked for typos. As far as the test is concerned then it's TM-650, Method 2.6.8E. I hope it will not contract your constructiveness. :-) Regards, Vladimir SENTEC Testing Laboratory Inc. 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (647) 495-8727 Cell: (416) 899-1882 www.sentec.ca -----Original Message----- From: Inge Hernefjord <[log in to unmask]> Date: Thu, 14 Mar 2013 17:01:26 To: TechNet E-Mail Forum<[log in to unmask]>; Vladimir Igoshev. PhD<[log in to unmask]> Subject: Re: [TN] IPC-6012 I'm not sure what 'contractive' means as I only have British English between my eyes, a weakness I have to live with. Mike may come to swing his formidable tongue, or Brian Ellis. However, partially 'flitted' pads sounds to me equal to future catastrophic failures. That you did not find flitting in IPC-6012 does not mean that the failure category doesn't exist. What is of most importance is what is required according to YOUR process documents! That is something that is hammered into my Cortex Electronica during many years at Ericsson. You mention nothing about your thermal stress conditions, so the gurus may have some difficulty with doing a correct judgement. Inge On 13 March 2013 22:18, Vladimir Igoshev. PhD <[log in to unmask]>wrote: > I have a question for boards gurus, > > We run a set of tests to assess the workmanship of a PWB. The board > had vias-in-pad (in essence PTHs overplated with Cu pads) under a BGA. > > After a thermal stress the pads were partially flitted due to cracked > laminated underneath them. To me it's a recipe for disaster (like pad > cratering after assembly). However, I saw nothing about it in > IPC-6012. Did I just miss it? > > I'd really appreciate any contractive comments. > > -- > Best regards, > > Vladimir Igoshev. PhD mailto: > [log in to unmask] > > SENTEC Testing Laboratory Inc. > 11 Canadian Road, Unit 7. > Scarborough, ON M1R 5G1 > Tel: (416) 899-1882 > Fax: (905) 882-8812 > www.sentec.ca > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________