Hi Inge ol' pal!
I went back and looked on my pages, and am not sure if they're still there. But one of these might be:
http://stevezeva.homestead.com/files/fracture_bad.jpg
http://stevezeva.homestead.com/files/fracture_bad_2.jpg
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
Sent: Wednesday, January 16, 2008 3:09 PM
To: [log in to unmask]
Subject: [TN] SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic
Not really true, the Scottish blood in my veines tells me to be careful with money, the kyrgise blood makes me crush the table, therefore, noone can actually be under it.
I think there are pictures from my large AuSn platelets somewhere on Gregory's wall. If not, I can probably dig them up again from some old report. If such crystals are abundant in a solder joint, the components may just jump off the board when giving a mechanical shock.
/Inge
-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Werner Engelmaier /*
Skickat: den 16 januari 2008 20:30
Till: [log in to unmask]
Ämne: Re: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic
Hi Inge,
As usual people are well advised not to argue with a (this) Swede; 1) he usually knows what he is talking about, and 2) if not, he will drink you under the table.
The IMCs formed by Sn/Pb, and Sn/Ag as well, are platellet-shaped crystals (in cross-section they may look like needles but are always plateletts), and I have seen no evidence that they are solderable. Solderability simply depends on how much Sn, or SnPb, to which you wet, is present. So the amount of these IMCs affect both solderability as well as Au/Ag-embrittlement.
Inge, how is Gerd? I sure have not heard anything about him for some time.
Werner
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