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Subject:	Re: What Causes Dlamination
From:	"Steffen, Don E" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Thu, 18 Oct 2001 20:05:52 -0500
Content-Type:	multipart/mixed
Parts/Attachments:	text/plain (1442 bytes) , text/html (2329 bytes) , text/plain (2329 bytes)

From my experience of Multilayer delamination of FR4 was because of over
stress because of temperature. The delamination was caused because of
moisture entrapment and then being subject to a spike in temperature.



-----Original Message-----
From: Randy Brooks [ mailto:[log in to unmask]
<mailto:[log in to unmask]> ]
Sent: Thursday, October 18, 2001 5:02 PM
To: [log in to unmask]
Subject: [TN] What Causes Dlamination


Multilayer delamination after SMT (FR-4 material)

Can anyone give me what are the most common cause(s) for delamination of

multilayer boards.



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