Subject: | |
From: | |
Reply To: | |
Date: | Mon, 11 Jul 2011 16:30:46 -0700 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Evamaria:
The J-STD-001 and the IPC-A620 are intended to always have the same process/quality requirements. The newer solder coverage requirements involve several different perspectives as follows:
Minimum Wrap Area: Solder fillet cover 75% of the required wrap (100% if wrap less than 90 degrees)
Minimum Wetted Height: 75% of the Wire Diameter (D)
Wetted Fillet: 50% of the Wire Diameter
This means solder must as a minimum WET up 75%D but the solder fillet may undercut the wire but must have a FILLET 50%D up the sides of the wire. I hope this explanation clarifies the intent of the requirements.
Gregg Owens | Sr. Technical Writer
Wavestream Corporation
(909) 599-9080 x 484 | [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Evamaria Jones
Sent: Monday, July 11, 2011 1:52 PM
To: [log in to unmask]
Subject: [TN] J-STD-001E 5.5 and IPC-A-620A 4.9 Terminal Soldering
I am confused. Is there a conflict between soldering to terminals requirement in 620A and J-STDE? I thought I understood the concept of height (climb on wire) of solder. Unfortunately, I can not interpret the depression percentages.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|