I am currently trying to determine the effect of board warpage on
reliability.  I'm looking in particular at the creep characteristics of
solder under constant strain conditions.  I have been told that complete
relaxation of the solder will occur within 24 hours at room temperature,
less than 24 hours at higher temperatures.  This leads me to conclude
that any failures due to the deformation of the board would occur within
24 hours.  Can anyone confirm or refute this?  Better yet, does anyone
know of a document which addresses this issue?  Thanks in advance.
Marc.

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