I am currently trying to determine the effect of board warpage on reliability. I'm looking in particular at the creep characteristics of solder under constant strain conditions. I have been told that complete relaxation of the solder will occur within 24 hours at room temperature, less than 24 hours at higher temperatures. This leads me to conclude that any failures due to the deformation of the board would occur within 24 hours. Can anyone confirm or refute this? Better yet, does anyone know of a document which addresses this issue? Thanks in advance. Marc. ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################