IPC and JEDEC have announced the Call for Participation for the 11th International Conference on Lead Free Electronic Components and Assemblies, scheduled to take place December 6-8, 2005 in Boston, MA.
Educational courses, as well as a technical conference will be held. IPC and JEDEC are seeking abstract submissions and workshops/tutorials on the following relevant subjects.
European lead ban status/policy development
European/Chinese/other legislation or voluntary activity on hazardous materials and recycling
Legislative compliance and policy enforcement methods
Supply chain issues
Marking and testing standards
Materials declarations, part numbers, obsolescence, etc.
Production issues
Design for lead free production
Component, solder, board developments, availability and lead free compatibility
Examples of implementation
Reflow, wave, hand soldering, inspection, repair, rework, test, etc
Reliability issues
Tin whiskers
Reliability test data and method developments
High reliability product sectors (automotive, aerospace, etc)
Environmental considerations
Toxicity and risk
Recycling
Substitutes for other hazardous substances (Cd, Hg, Hex. Cr)
Research consortia news and updates
Please e-mail your abstract submission or your course proposal to [log in to unmask] The deadline to submit an abstract or course proposal is September 6th.
Your company also has an opportunity to exhibit or take advantage of sponsoring part of this important industry event. For more information on signing up for an exhibit or a sponsorship opportunity, contact Gwen Jader via e-mail at [log in to unmask]
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Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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