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Mon, 24 Jul 95 15:14:01 -0400 |
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Mon, 24 Jul 95 15:26:01 -0400 |
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<"3BRWm.0.O4E.b525m"@ipc> |
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| From: |
"Jim Marsico" <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@a1.allin1.ALLIN1.umc> |
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ALL-IN-1 IOS Server for VMS V3.0 PBL123A (US) ENGLISH 21-MAR-1992 |
| From [log in to unmask] Sat Apr 27 14: |
25:04 1996 |
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<40131142705991/73373@ALLIN1> |
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I'm currently working on a research project to develop the
technology for including BGAs in our designs. The project will
include board design, solder joint volume, FEA, thermal
analysis, process optimization and rework and repair. The
assemblies will be ceramic BGAs soldered to polyimide
multilayer boards which will be hard bonded to a restraining
core made of silicon carbide/aluminum metal matrix.
My management is concerned that one of our customers, the Navy,
will be reluctant to allow the use of BGA technology on their
hardware, considering the difficulty we had in convincing them
to go surface mount.
I'm looking for a list of other electronics manufacturers who
are using BGAs on military contracts. If anyone is presently
doing so, please let me know.
Thanks in advance,
Jim Marsico
AIL Systems, Inc.
Deer Park, NY
[log in to unmask]
or 516-595-5879.
Thanks
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