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April 2005

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Subject:
From:
Leo Higgins <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Leo Higgins <[log in to unmask]>
Date:
Wed, 6 Apr 2005 15:25:12 -0700
Content-Type:
text/plain
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text/plain (178 lines)
Even if the resin layer was not contaminated/modified, perhaps the adhesive
in the areas where copper was removed would not bond well to underlying
surface?


Best regards,
Leo

Director of Applications Engineering
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas     78704

ph     512-383-4593
fx      512-383-1590
[log in to unmask]
www.asat.com


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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Jeffrey Bush
Sent: Tuesday, April 05, 2005 2:37 PM
To: [log in to unmask]
Subject: Re: [TN] Etching resin coated copper (RCC)


I will submit that the absorption of chemistry and copper will affect
the rheology of the material.  Poor cross-linking into the c-stage could
also affect performance - adhesion, dielectric properties, thickness,
etc.  Testing this would not be costly and may present some findings as
a function of your specific design, base materials, application,.....


Jeffrey Bush
Director, Quality Assurance and Technical Support

VERMONT CIRCUITS INCORPORATED
  76 Technology Drive - POB 1890
    Brattleboro, Vermont 05302
      Voice: 802.257.4571.21 Fax: 802.257.0011
           http://www.vtcircuits.com


-----Original Message-----
From: R Sedlak [mailto:[log in to unmask]]
Sent: Tuesday, April 05, 2005 3:13 PM
To: [log in to unmask]
Subject: Re: [TN] Etching resin coated copper (RCC)

I am convinced that Colin has hit it spot on the money, B Stage is
reactive, and will almost certainly react with Copper, and absorb it.
Perhaps a key question is, does this matter?

Rudy Sedlak
RD Chemical Company

Colin McVean <[log in to unmask]> wrote:
I would be concerned about the possibility of contamination into the
resin with etching solutions, which may stain and change properties etc
which will then be bonded onto a sub-assembly

If your talking about a single stage "B" stage with around 50-80uM of
resin, there may be handling issues, as the material is not as "solid"
and flexible as it would be after the change in rheology excursion
through the press. A 2 stage "B" and "C" may be more suitable for
handling, but the same concern refers as above to the "B" stage.

Colin McVean
Production Manager
Artetch Circuits Limited
Tel: 01903 725365

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of James W. High
Sent: 05 April 2005 16:35
To: [log in to unmask]
Subject: [TN] Etching resin coated copper (RCC)

RCC is a copper foil coated with B-staged epoxy resin. Is it possible
to
etch a pattern in the copper while the epoxy is still in the B-stage?
In
other words, will the chemical etchant attack the as yet not fully cured
epoxy? If anyone has actual experience doing this, please let me know.

Thank you,
James High

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