Even if the resin layer was not contaminated/modified, perhaps the adhesive in the areas where copper was removed would not bond well to underlying surface? Best regards, Leo Director of Applications Engineering ASAT, Inc. 3755 Capital of Texas Highway, Suite 100 Austin, Texas 78704 ph 512-383-4593 fx 512-383-1590 [log in to unmask] www.asat.com The information contained in this electronic message is CUSTOMER/SUPPLIER PRIVILEGED AND CONFIDENTIAL INFORMATION intended only for the use of the individual or entity named above. If the reader of this message is not the intended recipient, you are hereby notified that any dissemination, distribution and copying of this communication is strictly prohibited. If you have received this communication in error, please immediately notify the sender by electronic mail. Thank you. -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Jeffrey Bush Sent: Tuesday, April 05, 2005 2:37 PM To: [log in to unmask] Subject: Re: [TN] Etching resin coated copper (RCC) I will submit that the absorption of chemistry and copper will affect the rheology of the material. Poor cross-linking into the c-stage could also affect performance - adhesion, dielectric properties, thickness, etc. Testing this would not be costly and may present some findings as a function of your specific design, base materials, application,..... Jeffrey Bush Director, Quality Assurance and Technical Support VERMONT CIRCUITS INCORPORATED 76 Technology Drive - POB 1890 Brattleboro, Vermont 05302 Voice: 802.257.4571.21 Fax: 802.257.0011 http://www.vtcircuits.com -----Original Message----- From: R Sedlak [mailto:[log in to unmask]] Sent: Tuesday, April 05, 2005 3:13 PM To: [log in to unmask] Subject: Re: [TN] Etching resin coated copper (RCC) I am convinced that Colin has hit it spot on the money, B Stage is reactive, and will almost certainly react with Copper, and absorb it. Perhaps a key question is, does this matter? Rudy Sedlak RD Chemical Company Colin McVean <[log in to unmask]> wrote: I would be concerned about the possibility of contamination into the resin with etching solutions, which may stain and change properties etc which will then be bonded onto a sub-assembly If your talking about a single stage "B" stage with around 50-80uM of resin, there may be handling issues, as the material is not as "solid" and flexible as it would be after the change in rheology excursion through the press. A 2 stage "B" and "C" may be more suitable for handling, but the same concern refers as above to the "B" stage. Colin McVean Production Manager Artetch Circuits Limited Tel: 01903 725365 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of James W. High Sent: 05 April 2005 16:35 To: [log in to unmask] Subject: [TN] Etching resin coated copper (RCC) RCC is a copper foil coated with B-staged epoxy resin. Is it possible to etch a pattern in the copper while the epoxy is still in the B-stage? In other words, will the chemical etchant attack the as yet not fully cured epoxy? If anyone has actual experience doing this, please let me know. 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