TECHNET Archives

February 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
Subject:
From:
Roland Herold <[log in to unmask]>
Date:
Fri, 5 Feb 1999 15:03:58 +0100
Content-Type:
multipart/mixed; boundary="------------64898B4861608360209CA383"
MIME-Version:
1.0
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Roland Herold <[log in to unmask]>
Parts/Attachments:
text/plain (514 bytes) , 101.42979.vcf (133 bytes)
Welcome to wherever you are,
I have the urgent need of any specification which hits the fabrication
of 2 mil conductors on printed wiring boards.
The reason is a costumer of our company want to go into production with
this goal and I as a supplier of fabrication technologies must have a
knowledge of what is to be considered.
Is there any official IPC or MIL-specification?
I appreciate any comment or further help in this matter.

Thank you in advance

Roland Herold
Technical Center Electronics
ATOTECH Deutschland GmbH
Germany


ATOM RSS1 RSS2