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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 10 Apr 2000 09:49:16 +0100 |
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Creep v GB sliding
Grain boundary sliding is just one mechanism of creep. There are several
others with different controlling features; sometimes grain size - some
not!
Which mechanism is dominant is controlled by the stress and temperature (
more strictly the strain rate).
So, it is the service condtions which strongly influence the dominant
creep mechanism, and to 'improve resistance' you need to ensure that you
are enhancing the resistance to this particular mechanism. otherwise it is
a waste of time.
Incidentally, we are now measuring creep behaviour at -50C. It still takes
place in solders even at these very low temperatures.
Bill Plumbridge
Open University
Solder Research Group
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