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Date: | Tue, 13 Aug 1996 13:40:32 -0700 |
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We are looking to support our colleagues at various PWB testing
facilities, who are looking for an effective methodology for identifying
the locations of failure sites following accelerated stress testing. Our
present method utilizes an infra red thermal imaging system,
inconjunction with a low level (milliamps) DC current supply that creates
the necessary temperature differences to uncover the exact position of
one or multiple defect sites.
The cost of thermal imaging equipment is prohibitive for most
companies, we are looking for a lower cost alternative that has the
following capabilities:
Ability to uncover partial failures, defects that have not fully
propagated to an open state (opens are easily found with conventional
multimeters).
Ability to identify intermittent defects that are not detectable
unless the test vehicle is elevated to a temperature close to the
laminate Tg.
Ability to isolate (identify) defect location.
We are open to any suggestions/recommendations. We are
interested in any additional information regarding "thermal tapes/inks"
that can be applied to the surface of the test vehicle, to identify
localized temperature differentials. Electrical testing fixtures that
could accommodate the passing of DC current through the test vehicle
during the fault finding.
Respectfully,
Bill Birch
PWB Interconnect Solutions Inc.
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