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July 1998

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Sender:
TechNet <[log in to unmask]>
X-To:
Johannes Sivula <[log in to unmask]>
Date:
Mon, 6 Jul 1998 11:06:19 -0400
Reply-To:
[log in to unmask]
Subject:
Re: Polyimide See Thru Stencils for Printing Solder Paste
From:
Ryan Jennens <[log in to unmask]>
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Phoenix Engineering Design, Inc.
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We just started using them today and it took half the time to set them
up, because they are see-through.  Check back and I will let you know
the print results.

Ryan Jennens

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