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October 1999

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Subject:
From:
"Kenneth G. Stephens" <[log in to unmask]>
Reply To:
Date:
Mon, 4 Oct 1999 18:19:25 -0700
Content-Type:
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I suspect your heat sink pins that are soldered as through hole components
are rectangular in shape.
If they are why not make the holes they go in smaller so that a little
pressure is needed to insert the
Heat shield.  Square peg in round hole principle.  Sounds like an engineer,
they say under their breath.


Ken Stephens, President
CAD 2 CAM, Inc.
www.cad2cam.com
[log in to unmask]
503-246-4692

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Ken Patel
Sent: Monday, October 04, 1999 5:57 PM
To: [log in to unmask]
Subject: [TN] Looking for Help to prevent Tilting of EMI shield

Guys,
We are currently using a EMI shield which is dual in nature i.e. perimeter
is connected like SMT and leads are soldered like PTH. This shield is being
hand placed onto the board before reflow where perimeter is getting
connected to the board while the leads are soldered when the board goes to
wave soldering process.

Our problem is that this part is getting tilted easily and to prevent that I
am looking for some kind of solution- Does anyone has tried out the kinked
leads to provide snap fit so that it won't tilt during the reflow operation.
Any other potential solution to stop the tilt besides some kind of weight.
Does anyone ordered die and formed the leads and resolved the tilt problem?

My part is 1.5" X 2.5" with .5" height. Leads are .5" apart.


re,
ken patel

______________________________________________________
Ken Patel                       Phone:  (408) 490-6804
1708 McCarthy Blvd.             Fax:    (408) 490-6859
Milpitas, CA 95035              Beeper: (888) 769-1808

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