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Date: | Tue, 21 Jun 2016 19:55:40 -0400 |
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what is the flux in your 63/37? what is the flux of 305?
On Jun 21, 2016, at 7:42 PM, Mumtaz Bora wrote:
> Hello Technet team,
>
> We have a laminate based QFN package with ENIG plating on
> terminations. Using lead based paste Sn63/Pb37, we fail
> solderability test per JESD22B102E (dip and Look test) and also per
> J-STD-002 method B (dip and Look test). However, we passed reflow
> solderability test using lead free paste (SAC 305) per method
> JESD22B102E . Due to product requirements, we have to use eutectic
> Sn63/Pb37 solder paste. The reflow oven is convection air . If
> anyone had this issue and can share some insight or inputs will be
> much appreciated.
>
>
> Thank-you,
> Mumtaz
> 858-795-0112
>
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