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November 1998

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TechNet <[log in to unmask]>
Subject:
Attaching Al heatsink to Si die
From:
John Loveluck <[log in to unmask]>
Date:
Tue, 17 Nov 1998 10:53:12 -0600
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"TechNet E-Mail Forum." <[log in to unmask]>, John Loveluck <[log in to unmask]>
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Hi

Does anyone have practical experience of the effects of thermal expansion
mismatch on a thermally conductive glueline between a silicon die (in our
case, Motorola MPC740 BGA Power PC processor) and an aluminium heatsink?

We have looked at several adhesives, some of which are much more compliant
than others, and are looking for criteria on which to base the final decision.

Thanks

John

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