Sender: |
|
X-To: |
|
Date: |
Tue, 26 Jun 2018 13:58:11 +0000 |
Reply-To: |
|
Message-ID: |
|
Subject: |
|
From: |
|
MIME-Version: |
1.0 |
In-Reply-To: |
|
Content-Transfer-Encoding: |
base64 |
Content-Type: |
text/plain; charset="utf-8" |
Parts/Attachments: |
|
|
We were notified many "common" 0603 MLCCs were going to 52 week lead times. The world is going to smaller packaging. Ok, so how do I make 20 kilowatts with 0402 parts? We work in brute force, 1,200 volts at 100 amps, and still use thru hole parts because they can handle the power. I can see it now, we will use fifty 0201 resistors to get the power level we need. Geesh!
It is going to be interesting how we build in a world of smaller parts.
I know, you can't buy a '57 Chevy new anymore. But imagine if you could Cool!
Phil
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Nigel Burtt
Sent: Tuesday, June 26, 2018 9:48 AM
To: [log in to unmask]
Subject: Re: [TN] Passive component downsizing
Of course, hence "...suitably limited implementation..." in my post.
I'm thinking of assembly problems: printing, SPI, placement, reflow, AOI etc - even if one could come up with a suitable mixed footprint stencil aperture, would the resulting solder joint meet IPC-A-610 visual inspection acceptability conditions for example.
Then there is the in-service-reliability aspect of the solder joints
|
|
|