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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 6 Mar 2001 11:03:47 -0500 |
Content-Type: | text/plain |
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Those old Orthodyne Model 20 manual wedge bonders will out-live us all!
This is one of those, "Don't hold me liable for anything" types of
situations. I merely wished to indicate that we had found that the hermetic
environment was NOT a good way to run aluminum wire on bare copper.
That does not necessarily mean that it is safe to use in a non-hermetic
environment, you have to make that call. I know of situations where parts
have been glob topped for industrial applications, but I certainly would be
very reluctant to use something like that in a medical, or any other
application where a human life could be impacted.
For lab, or research types of testing, where the parts never leave the lab
atmosphere, it will probably work for you (with a little caveat about your
skills regarding the establishment of a good bond schedule).
Just remember, it doesn't take all that much to eat the aluminum pad off the
chip.
Steve
At 10:09 AM 3/6/01 +0100, you wrote:
>A big thank you to everyone. Really¡¡
> I'm very surprised with your help, more specific and faster than I could
>be expected
>I was trying with a 15 mils wire with a semiautomatic large
>(ultrasonic-wedge) wirebonder older than me.
>Now I'll buy a new aluminum wire (heavy aluminum seems the easiest/fastest
>solution) and also I'll start to search how to plate my copper pad.
>
>Steve, can I understand (with the heavy aluminum option) from your answer
>that I must not worry about the environment? Can I do it in the open air?
>
>I can't thank you enough your help
>
>
>Josep M. Badia
>Servei de Recursos Tècnics
>Tèlf/Fax: 977 559630/559605
>Univ. Rovira i Virgili
>
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