Hi,

On a related note, there is an israeli startup, https://linkprotect.cudasvc.com/url?a=https%3a%2f%2fCybord.ai&c=E,1,zO9yvGVEuQV_YUMF7akFAXDjdYiQT2HG05P99AhlPY09hUk8-dsNWwkV6XCGf4u34YqJMKLaSYA-n2XsOdlmCwj21wVowq1rLHBdnsTIZQ,,&typo=1, working on a
technology to detect counterfeit parts during assembly.
Here there is the interview with their CEO.   I found it quite interesting.

https://www.youtube.com/watch?v=MGyqG_KDy_c

Jesus

On Thu, 10 Feb 2022 at 02:52, Wayne Thayer <[log in to unmask]> wrote:

> Thanks to all respondents--good tips. I wasn't aware of the leader part
> issue: Very impressive they can meet exactly the same visuals.
>
> I also look forward to looking over what Richard posts tomorrow (as always
> with posts from Richard!)
>
> Wayne Thayer
>
> On Wed, Feb 9, 2022 at 2:55 PM Yuan-chia Joyce Koo <[log in to unmask]>
> wrote:
>
> > x-ray is good tool to see if different location using different size
> > of chip (chip shrink) or not - you might have different working temp
> > range due to MFG process limitation.  Way back, one of the vendor
> > provide chips at reduced temp range (different bin) for far east
> > commercial usage, but main location process version got wider temp
> > range and narrower parameters.  I order specified for main location
> > only with 6month early notification with possible "last time batch
> > buying" if MFG location change (pay extra for the clause).
> > - I was told un- officially, the difference due to less MFG of
> > environment control (water, cleanroom, etc) and eliminate burn in
> > steps with off shore location.
> > that is beside the counterfeit.  good luck.
> > jk
> > On Feb 9, 2022, at 1:44 PM, Wayne Thayer wrote:
> >
> > > Greetings-
> > >
> > > The only way I've been able to keep parts moving in this
> > > environment of
> > > part shortages and 72 week lead times is by constantly finding
> > > substitutes.
> > >
> > > The least appetizing substitute option is offshore brokers. We are
> > > revising
> > > our counterfeit detection strategy for minimizing cost/benefit (and
> > > time).
> > > My inclination is to do careful visual inspections, especially
> > > labels and
> > > lead finish, followed by solvent testing and a simulated Pb-free
> > > soldering
> > > profile on samples of the lot. I also compare the decapsulated die
> > > faces
> > > with known genuine parts.
> > >
> > > Is anybody else working this issue? Our old corporate document
> > > suggests XRF
> > > and x-ray inspection, but I'm not seeing the value in those. XRF is
> > > a great
> > > way to see if your system is Pb-free, but I'm more interested in
> > > whether
> > > the leads were soldered to previously which a thorough visual
> > > inspection
> > > should find.
> > >
> > > Thanks,
> > >
> > > Wayne Thayer
> >
> >
>