We are looking at assembling SMT componentry with 16 mil pitch. Can
anyone advise on recommended stencil thickness and aperture dimensions?
The component is a 48 pin VSOP. The pad size on the card is 0.080 thou
by 0.008 thou.
IPC-SM-782 Revision A doesn't cover this.
Regards, Evan Internet: [log in to unmask]
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