TECHNET Archives

January 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Content-Transfer-Encoding:
7bit
Sender:
Subject:
From:
Date:
Mon, 12 Jan 1998 11:15:19 -0600
Content-Type:
text/plain; charset=US-ASCII
MIME-Version:
1.0
Reply-To:
"TechNet Mail Forum." <[log in to unmask]>, [log in to unmask]
Parts/Attachments:
text/plain (21 lines)
     Has anyone found a dependable, simple, one part adhesive for securing
     jumper wires to circuit boards that is approved for Class II
     assemblies?  We currently use "Tak-Pak" and a two part 50/50 mix epoxy.
     The problems that we run into is that the Tak-Pak dries to a non
     aesthetically pleasing white color and/or the operators (sometimes)
     don't mix the 50/50 properly and it does not harden.  Any suggestions?

     Mark

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################


ATOM RSS1 RSS2