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August 2000

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TechNet <[log in to unmask]>
Subject:
Silver Palladium plating
From:
Creswick <[log in to unmask]>
Date:
Tue, 1 Aug 2000 21:48:27 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, Creswick <[log in to unmask]>
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Ken,

Unless the underlying termination has a nickel barrier layer to prevent
leaching of the component termination, I would be extremely cautious about
doing as you suggest.

Steven Creswick
CTS RF Integrated Modules

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