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November 2018

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TechNet <[log in to unmask]>
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TechNet <[log in to unmask]>
Date:
Mon, 19 Nov 2018 08:33:50 -0600
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TechNet E-Mail Forum <[log in to unmask]>, Jack Olson <[log in to unmask]>
Subject:
depanelization
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From:
Jack Olson <[log in to unmask]>
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Is there any IPC document that addresses the METHOD of depanelization?
(we have an array of assemblies in pallet form with break-away tabs)

I found the acceptability of the RESULT of depanelization in IPC-A-610
10.2.8,
but that does not address the risk of the method (stress on components and
solder joints,etc).

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