Hi Werner;

My apologies for providing little information.
I just became a member of TechNet yesterday and this is my first inquiry.

The condition is being seen on .062, double sided boards.
The lift being seen is both foil separation from the resin and tearing of
the resin below the foil without the foil separating from the resin.

The dwell time in HASL has been reduced to approx. 1 second with a
temperature ramp down after HASL of about 5 minutes prior to
post-cleaning.
The copper plating tanks have recently been carbon treated and the
elongation of the copper has been tested (currently 13%).
Different laminate manufacturers have been processed and the problem
appears regardless of laminate manufacturer.

This condition is appearing on the bare board, not assembled product.

Does TechNet etiquette allow me to attach a picture with my initial
inquiry or responses?

Regards,
Rob





Werner Engelmaier <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
04/09/03 11:35 PM
Please respond to "TechNet E-Mail Forum."; Please respond to Engelmaier


        To:     [log in to unmask]
        cc:
        Subject:        Re: [TN] TechNet E-mail forum / Lifted lands / As Received sample /  Root
causes?


Hi Robert,
You provide precious little info on your problem.
When you say "lifted lands" what do you mean? Land rotation?
How thick the PCB?
On the basis of what have"Thermal, copper elongation and material factors
have been removed from the equation as non-influences"?
Is this a PTH or a PTV?
What is the history?
If it is a PTV, what kind of component lead is in the PTV?
What kind of soldering processes have been used?

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 386-437-8747, Fax: 386-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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