Steve:

It sounds good in theory, but in practice there will be a difference.  When
plugging vias with solder resist, it often took six or more (nine or twelve)
strokes to fill a via from one side on nominal .060 to .070 thick boards.
My read is that a second pass will result in an additional 5 to 10 mils of
fill.....definitely not enough additional metal to make a difference.

Look at it this way......the pads with a via make for easy rework......just
touch the lead and it's ready for a jumper.

Don Vischulis

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of [log in to unmask]
Sent: Wednesday, April 03, 2002 6:06 PM
To: [log in to unmask]
Subject: Re: [TN] Vias in pads


Hi Mark,

I hope you've seen my pictures and seen what happened with me. But something
you might try that I didn't think of when I ran my ten boards, is to do a
double print stroke when printing the board...this may "force" some of the
paste down inside the via and give it a bit of additional paste to fill down
inside the via so that it doesn't suck so much from the fillet... maybe
worth a try.

-Steve Gregory-
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