TECHNET Archives

June 2015

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
X-To:
Date:
Tue, 2 Jun 2015 18:17:45 -0300
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Ricardo Moncaglieri <[log in to unmask]>
Subject:
MIME-Version:
1.0
Message-ID:
Content-Transfer-Encoding:
8bit
Content-Type:
text/plain; charset="UTF-8"
From:
Ricardo Moncaglieri <[log in to unmask]>
Parts/Attachments:
text/plain (19 lines)
Dear Colleagues,
Have to deploy a process and its qualification in order to perform
electrical connections which will be working under temperature
variations in the range of -100°C to +100°C (space application).
We are pointing to SnIn solder alloy.
We are just now starting  our investigation in our first steps.
Will be invaluable some advise as per your background so as directing
me to some std and/or paper about best applicable solder alloy and its
qualification method.
Being grateful in advance.
brgds, Ricardo Moncaglieri
 


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2