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Date: | Thu, 28 Jul 2005 13:38:55 EDT |
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In a message dated 7/28/2005 11:44:13 A.M. Eastern Daylight Time, Jeffrey.Bu
[log in to unmask] writes:
Does anybody out there have Board surface recommendations for a RoHs
process ?
____________________________________
I'd recommend Pb-free HASL:
* far-better planarity than it's lead-based counterpart, appropriate
through 20-mil pitch.
* no embrittlement possibilities like ENIG,
* solder to copper instead of nickel as with ENIG (and all that
implies)
* cheaper than ENIG
* excellent shelf life
* can be reworked
* doesn't introduce 3rd/4th metals to your solder joint as with ENIG
* isn't banned by the Aerospace industry like immersion silver
* can be retrofitted in pre-existing HASL equipment at a fraction of
the cost to installing silver / tin / ENIG / OSP lines.
* has reduced handling sensitivities versus OSP, TIN or SILVER
* is appropriate as a final finish, whereas no SILVER or OSP
manufacturer warrants immersion processes as a final post-assembly finish.
* ...and despite Urban Legends, lead-free HASL solder is available in
operating temperatures suitable for 140-deg. FR-4.
Many veteran process engineers still find nothing solders like solder, and
there's good reasons for their position. But I'm hoping you want more than
anecdotes so write-back if you'd care to pursue Pb-free HASL further.
Cheers!
ROBERT LAZARA
VP, Marketing & Tech Support
Tel: (800) 560-9457
Fax: +01 603.880.7975
=Circuit Connect=
UL Listed - ISO Registered - SMTA Member - IPC Member - EPA Partner
- RoHS Compliance
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