I am characterizing a high d.k. metallized dielectric film for use as bulk and individual buried capacitors in PCB's.  The film is only a couple microns thick and the metallization is thinfilm.  Needless to say, handling and processing in a PCB environment needs some creative solutions. Using combinations of blind vias, premounting to prepreg/predrilling any PTH/NC (no connect) areas, temporary carriers for 2 sided imaging... I've come up with some methods.  One question that arises is what would the reliability be of a plated thruhole which connects to copper cladding which may only be 1/4 to 1/2 micron thick vs. a normal minimum 10 microns with 1/4 oz copper foil???  Any suggestions would be appreciated.
Resp
Phil Hersey