Jack,
Are you saying stacking of components are acceptable? Please elaborate your comments.
re,
Ken Patel
Jack Crawford wrote:
> The official release of 7721 Change 2 can be downloaded FREE from the IPC Website http://www.ipc.org and select the link to "On-Line Resources . . ." and on the new page to "IPC Documents for Download".
>
> jack
>
> >>> [log in to unmask] 09/27/01 01:03PM >>>
> Tim,
>
> We're often asked to stack chip components and perform other odd
> modifications. We have also added a new procedure to IPC 7721 called
> Component Modifications and Additions. You can preview our version of this
> procedure, including images of stacked components, on our web site at:
> http://www.circuittechctr.com/guides/6-3.htm
>
> Jeff Ferry, CEO
>
> Circuit Technology Center, Inc.
>
> Chairman
>
> IPC Repairability Committee
>
> On Wed, 26 Sep 2001 09:10:38 -0500, Tim Devaul <[log in to unmask]>
> wrote:
>
> >Good morning,
> >
> > I am in the middle of a slight disagreement between a couple of our
> company's organizations. It is over stacking
> >SMD chips, specifically 0603s. In a temporary rework fix engineering wants
> to stack and solder one chip directly on top of the other. Does anyone have
> any experience positive or negative concerning this practice?
> >
> >Tim DeVaul
> >Quality Assurance Training and Audit Supervisor
> >Philips Broadband Networks, Inc.
> >100 Fairgrounds Dr.
> >Manlius, New York 13104
> >Tel: (315) 682-9105 Ext. 2403
> >Fax: (315)682-9006
> >Email: [log in to unmask]
> >
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