Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 6 Nov 2001 17:06:06 -0700 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi Genny,
Don't worry about using HASL with BGA's. They will be just fine. Fine
pitch on the other hand....
Kind Regards
Ryan Grant
Advanced Technology Engineer
MCMS
(208) 898-1145
[log in to unmask]
> -----Original Message-----
> From: Genny Gibbard [SMTP:[log in to unmask]]
> Sent: Tuesday, November 06, 2001 3:16 PM
> To: [log in to unmask]
> Subject: Re: [TN] BGA's in design
>
> Thanks to all suggestions. I found a good app note on the Xilinx site for
> Board Routability Guidelines for Fine Pitch BGA Packages which is very
> helpful.
> As I expected, I got a few direct solicitations from board fab places,
> mostly US, but no good testimonials of good experienced Canadian fab
> houses.
> I really do not want to go across the border at this time as we currently
> do
> not use any fab places outside the country, and it adds a whole other
> level
> of complexity to shipping as well as possible delays especially with
> heightened security these days.
> Regards,
> Genny.
>
> To open another can of worms, most datasheets or app notes have said 'use
> NiAu or OSP finishes'. We have 99.99% of the time so far used HASL (no
> BGA's), have been made very wary of NiAu and have never tried OSP. We
> have
> tentatively approved immersion Tin as an alternate finish in select cases
> but have not used it, and I'm hearing a lot about immersion Ag these days.
> Survey: What do you use for your BGA board finish?
>
> --------------------------------------------------------------------------
> -------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following message: SET
> Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources & Databases >
> E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> --------------------------------------------------------------------------
> -------
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
|
|