TECHNET Archives

February 2005

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Content-Type:
text/plain; charset=us-ascii
Sender:
TechNet <[log in to unmask]>
Subject:
Re: Mixing Lead free BGAs with normal BGAs
From:
bob wettermann <[log in to unmask]>
Date:
Fri, 11 Feb 2005 19:23:15 -0800
MIME-Version:
1.0
X-To:
[log in to unmask]
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, bob wettermann <[log in to unmask]>
Parts/Attachments:
text/plain (23 lines) 
Many companies are reballing BGAs, both ceramic and plastic body types, with Pbfree solder spheres in order to avoid the issue.

Companies like our and others can perform this service or you can purchase preform kits and "do it yourself"

Bob Wettermann
BEST Inc
847-797-9250



Bob Wettermann

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
PH 847-767-5745

ATOM RSS1 RSS2