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September 2000

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From:
"Lam, Patrick" <[log in to unmask]>
Date:
Thu, 28 Sep 2000 09:28:30 -0700
MIME-Version:
1.0
X-To:
Mark Hargreaves <[log in to unmask]>
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, "Lam, Patrick" <[log in to unmask]>
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Hi Mark,

My way to handle situation like yours is:
Forget plugging those vias with soldermask, it costs extra money and causes
other problems used a 20 mil soldermask which is smaller than the via pad,
thus provide more clearance between the BGA pads and the vias. It works for
us and my production people are happy.

Patrick Lam


-----Original Message-----
From: Mark Hargreaves [mailto:[log in to unmask]]
Sent: Thursday, September 28, 2000 8:57 AM
To: [log in to unmask]
Subject: [TN] plugging vias w soldermask


Hi All,
     Here's the scenario: We're making a small board with a 133 pin PGA.
Many vias between pads (Vias are 12 mil hole/ 25 mil pad). Customer wants to
avoid shorts under the PGA during assembly and is requesting that we plug
via holes and cover the vias on the part side.  What's the best way to do
this.  (We've got LPI and SR1000 to work with).


Thanks,
Mark Hargreaves
EMDS

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