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Date : 23/11/96 16:56
Msg From: PROCESS ENGINEERING
hello,
we are facing a problem of spreading of paste flux (water soluble
paste) on either side of the pad just after printing (contact
printing using 6 mil laser cut stencil). This is clearly observed
under 4x magnification, particularly for 20 mil pitch component.
is there any flux spread test for solder paste .
regards
nalin
altos india ltd.
altos india ltd.
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