Nick,

If your PWB finish is HASL it might not make a lot of sense.  If it happens to
be OSP it makes a lot of sense as OSP in not conductive and I understand
it tends to cause problems with test probes.

We use OSP and I have added our test points to the solder stencil for this very
reason.

DT




At 02:58 PM 8/25/99 -0400, you wrote:
>On double reflow boards our ICT test engineers now want to solder paste the
>solder side test points prior to reflow. We do not see any advantage to this
>but about 2000 more holes in the stencil. What are your ICT people saying.
>
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