 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uwamw-0000QuC; Fri, 30 Aug 96 16:07 CDT |
| Old-Return-Path: |
|
| Date: |
30 Aug 96 17:06:05 EDT |
| Precedence: |
list |
| X-Loop: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| From [log in to unmask] Fri Aug 30 16: |
52:06 1996 |
| Resent-Message-ID: |
<"U5qn93.0.kwA.PWr9o"@ipc> |
| Subject: |
|
| From: |
|
| Message-ID: |
|
| Resent-From: |
|
| Parts/Attachments: |
|
|
We are a double-sided bare board manufacturer, and for the first time a
customer of ours is considering the use of chip-on-board technology in their
design. Since we have no experience in fabricating for this purpose, we would
like to know what issues and specifications we'll be facing...such as final
finishes, geometry, tolerances, etc., that will be required by the wire
bonder/assembler. It's my understanding that the COB device has 8 leads.
Thanks in advance for any input.
Bill
[log in to unmask]
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
