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July 1997

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Wed, 30 Jul 1997 18:31:28 +0300
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>From willli Wed Jul 30 12:
15:58 1997
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Subject:
cleaning /rework of osp packs
From:
Baruch Schifman <[log in to unmask]>
From [log in to unmask] Thu Jul 31 12:
10:37 1997
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hello
                                                                        
    
we are facing a wave solderability  problem of cleaned ,from either
paste or adhesive,  misprinted osp        (entek 106)coated packs.The
cleaned packs are usually double reflow processed in N2 atmosphere -no
       clean process and then exposed to water based no clean flux in
N2 wave soldering process                    
Those reworked packs shows poor via wettability during wave soldering.
                                               
can you recommend a cleaning procedure & materials that will clean paste
and smut adhesives from the pack without causing any damage to the sop
layer the pre soldered devices.
         

                                                 
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