Hi All,
This is where I am on the seepage problem after wave solder 
under the removable solder mask.

We have evaluated problem parts and none problem parts.

Problem parts have exposed landing around the edge.
We are now asking our supplier to correct their screen to allow for 
shrinkage after curing time.
Note: with the understanding that the PCB has been properly 
cleaned.
I will know more after the sample shipment arrives and we
run the trail. 
We are pretty sure this will take care of our problems.

I really had a hard time believing that this was a typical defect occurrence for this process in the states.
Process of applying R.S.M.

Wish us luck

Nancy

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