Hi All, This is where I am on the seepage problem after wave solder under the removable solder mask. We have evaluated problem parts and none problem parts. Problem parts have exposed landing around the edge. We are now asking our supplier to correct their screen to allow for shrinkage after curing time. Note: with the understanding that the PCB has been properly cleaned. I will know more after the sample shipment arrives and we run the trail. We are pretty sure this will take care of our problems. I really had a hard time believing that this was a typical defect occurrence for this process in the states. Process of applying R.S.M. Wish us luck Nancy ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################