Just for fun I'll throw this in... there is an alternative to both epoxy and solder for electrical connection of IC's to printed circuit boards.  SMT, CSP, or Flipchip actives are glued pads/connections down onto a PCB.  It doesn't matter if the glue covers the connection area or not.  Then vias are laser ablated from the backside of the board to each metal connection pad (laser stops at higher melting metal).  Electrical connection is made by sputtering of metal through the holes to the pads in large batch chambers.  No solder, no epoxy and chip adhesive layer can act as a TCE interposer.

Down with lead.

Phil Hersey

P.S. Europeans have somewhat of a head start on us in experiencing the effects of pollution in their small highly populated continent.  A Norwegian customer tells me all the lakes there are dead due to acid rain from England.