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July 1997

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From [log in to unmask] Fri Jul 25 08:
43:35 1997
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>From willli Thu Jul 24 04:
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Subject:
Thermal considerations in BGA design
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"Karl Bornemann" <[log in to unmask]>
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I am trying to get some information on how to address and overcome the
thermal concerns associated with secondary reflow of BGA sites during
assembly.
Typically a secondary application of soldermask is applied to the vias
connected to the BGA sites (bottom side) to act as a barrier to heat
conduction. However the nature of the plugging operation (IPC indicated 95%
plug capability is pretty standard). I am interested in any papers, studies
or information which deals with the board requirements to avoid the
potential reliability problems associated with secondary reflow.

Thanks in advance,
Karl

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