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Their process is basically a microetching process. They call it
"CZ-treatment" and use special etchant "CZ-8100". Because the
treatment does not contain copper oxide, they say it does not
show "pink ring" and the bond strength is very stable after heat
shock and moisture adsorption.
I have a copy of their paper but unfortunately it is written in
Japanese. To get more information, it is better to contact
MEC Co. directly. Their fax number is,
Fax: 81-6-488-8404
F.Kuwako
Mitsui Mining & Smelting Co.
Copper Foil Division
Japan
>
> From: Scott Westheimer
> Date: 2/5/97
>
> Have anyone heard of a new oxide treatment or reducer from Japan called
MEC
> etch bond? Any information would be appreciated.
>
>
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