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February 2001

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TechNet <[log in to unmask]>
Subject:
Re: CornerBond 3515
From:
Angel Pulido <[log in to unmask]>
Date:
Wed, 14 Feb 2001 16:05:01 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, Angel Pulido <[log in to unmask]>
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> Hi ;
> Does anyone have experience with the CornerBond 3515 (Loctite) ?? that is
> a new adhesive with high curing temperature (I think similar to the reflow
> solder process), and used to minimize the effect of induced stresses
> between the array packages and the PCB.
>
> Thanks in advance...
> Miguel A. Pulido
>
>

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