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August 2003

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Subject:
From:
Murulidhara S <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 5 Aug 2003 12:26:46 +0530
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Dear Technetters,

We are facing problem in tin plating. In pad areas plating is dull and in remaining areas plating is bright.
This results in removal of copper from pad areas in etching stage. Can any one tell us reason for dull plating in pad
areas and also suggest remedy for the same. We are using grauer & weil chemistry for tin plating.

Regards,
Mr. Murulidhara S.
Deputy Chief Engineer ,
PCB and Chemical Lab - R&D,
ITI Ltd. ,
Dooravani Nagar , 
Bangalore
INDIA
PIN-560 016

Ph : 91-080-8503959
Fax : 91-080-5650971

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